Dow Electronic Materials, a business of Midland-based Dow Chemical Co. (NYSE: DOW), is bringing a new suite of products to printed circuit board manufacturers. The new products include two, newly launched products in final finish, and four new products under mass production testing in electrolytic plating and making holes conductive.
Dow also announced a variety of other products and services in many of its other divisions.
Dow has launched two solutions used during the final finish stage where the coating layer is created on the conductive pad surface to provide solderability, wire bonding and protection.
Aurolectroless SMT 520 Immersion Gold provides a cost-effective solution that permits operation at low gold salt concentrations to reduce gold consumption in ENIG (Electroless Nickel Immersion Gold) processes. The product provides excellent deposit coverage to increase corrosion resistance during subsequent process steps.
Silveron MF 100 Autocatalytic Silver with Immersion Gold has been developed as a high-performance replacement for immersion silver and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold). The dense silver coating prevents diffusion of copper to the silver surface and reduces formation of copper oxide. The deposit provides a combination of excellent solderability and gold wire bondability, which brings robust quality for PCB and electronics.
For PCB electrolytic plating, two products in mass production testing have been designed to meet specific market segment requirements for electrolytic plating. During this plating stage, the plating additive materials are used to create copper conductive layer with better uniformity and distribution. Dow’s Next Generation Thick Panel Copper Plating has been developed to enhance throwing power for very thick panel plating (over 3.2 mm thickness.). The High Speed Direct Current Copper Plating product provides better throwing power at increased plating densities on high aspect ratio and microvia boards. Both of these products help to increase plating efficiency and obtain higher productivity without the need for customers to invest in extra equipment.
Dow has two new products in mass production testing to support the part of the process where materials are used to create an initial deposit onto which an electrolytic layer is later deposited.
The first, Advanced SAP Metallization is a total solution for SAP (Semi-Additive Process). Its novel chemistry includes neutralizer, conditioner, and electroless copper. It provides high dielectric adhesion with low roughness, outstanding plating coverage on both via bottom and surface, excellent bath stability and reliability performance, making it the best choice for current and next generation ultra fine line SAP.
In other Dow product announcementsL
* Dow Chemical announced it had has achieved record supply volumes of Dowtherm A for solar power applications in 2010. To date, Dow has filled 14 large concentrating solar power plants in Spain and the United States, with a total capacity of more than 700 megawatts. These plants will provide power for the equivalent of approximately 415,000 homes and save 1.6 million metric tons of CO2 emissions per year. As a market leader in CSP grade heat transfer fluids, Dow is prepared to offer complete customer service to support this market growth, including innovation, engineering expertise, reliable supply chain and delivery of high quality, high volume products to remote locations.
* Dow AgroSciences, a wholly owned subsidiary of Dow Chemical, entered into an exclusive commercial license agreement with Norwich, England-based Plant Bioscience Ltd. for technology that enhances the root systems of plants with important implications for crop improvement. The technology was developed by Liam Dolan and his colleagues at the John Innes Centre, an institute of the BBSRC in the Norwich Research Park. The team cloned and characterized genes which may play vital roles in anchorage, water use, and nutrient uptake in plants. The genes are highly conserved among land plants, and the technology has already been shown to be effective in enhancing root systems in transgenic plants of major crops around the world.
* Dow AgroSciences also announced a deal with North Carolina-based Viamet Pharmaceuticals Inc. for a crop protection research, option, and license agreement to evaluate the potential use of Metallophile Technology to develop novel agricultural chemicals with new modes of action. Under terms of the agreement, Viamet will utilize its proprietary technology and Dow AgroSciences will employ its proprietary compound screening and product development capabilities, to discover and develop product candidates against priority targets in the crop protection field.
(c) 2010, WWJ Newsradio 950. All rights reserved.