Dow Electronic Materials Electrolytic Copper Wins New Product Award: Dow Electronic Materials, a business unit of Midland-based Dow Chemical Co. (NYSE:DOW), announced that its Microfill THF-100 Electrolytic Copper received the New Product Introduction Award from Printed Circuit Design and Fab Magazine in the plating category. Microfill THF-100 Electrolytic Copper is recognized as a value-added product enabling the miniaturization of next generation devices. It delivers enhanced performance and high reliability through a shortened manufacturing process. Dow’s new products have won five NPI awards from PCD&F in the Desmear, Final Finishes, Electrolytic Plating and Imaging categories since 2009. The NPI Award, in its sixth year, recognizes the leading new products from the previous year. Awards are selected by an independent panel of industry engineers. Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, smart phones and tablets and other mobile devices as well as electronic devices and systems used in a variety of industries. More information about Dow Electronic Materials can be found at