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Troy Software Firm Makes First Sale In China: TES International LLC of Troy said last week that it had made its first sale in China of Version 4 of its ElectroFlo software for the thermal analysis of electronic components, boards, boxes and racks. This software package is fully functioned including computational fluid dynamics, radiation, a coupled electrical solver, an embedded flow network solver, an extended thermal network solver and a new interface for importing geometry and post-processing. It is exceptional for the analysis of high power or high current density systems. The software has been the beneficiary of a million dollar upgrade from a contract from the Army with support from the State of Michigan. TES will be demonstrating the software at booth 708 at the Convergence Conference at Cobo Center on Oct. 19 and 20. TES also has a new address in a larger office, at 1711A Larchwood Drive, Troy. The company said the new space has more room for testing and validation work and allows room for our 14-foot panel truck mobile test bed as well as our bench scale wind tunnel for component testing. TES International offers services in electronics cooling, thermal analysis and structural analysis as well as CFD. It has been serving the automotive and aerospace industries for 16 years. We have worked on projects for a wide variety of companies including: Delphi, General Electric, General Motors, Ford, Chrysler, Bosch, Hamilton Sundstrand, Boeing, United Technologies and the U.S. Army’s Tank-Automotive Research, Development and Engineering Command. TES has engineers involved in software development for a variety of applications including a contract from TARDEC. The company says it is also working on a more generalized thermal analysis package under a separate Army contract which should be released in a few months. More at www.tesint.com.
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